Advanced Non-Contact Optical Measurement for Deformation & Strain Analysis

The XTDIC 3D Full-Field Strain Measurement System integrates Digital Image Correlation (DIC) technology with stereo vision to provide real-time, high-precision measurement of 3D surface coordinates, displacement, and strain.

By tracking surface speckle patterns or natural textures, the system performs stereo image matching and 3D reconstruction, delivering comprehensive deformation and strain data during static or dynamic testing.

Key highlights:

• Non-contact, portable, and easy to operate

• Real-time full-field 3D measurement

• Wide strain measurement range: 0.002% to over 2000%

• Adaptable to indoor, outdoor, and extreme environments

• Scalable measurement area: few mm² to tens of m² (customizable)

How It Works – Technical Principle

Camera calibration: Cameras are calibrated to determine intrinsic parameters (focal length, distortion) and extrinsic parameters (spatial positioning).

Speckle preparation: The object’s surface is prepared with a speckle pattern (or uses its natural texture).

Image acquisition: One or more synchronized cameras capture the deformation process in real-time.

3D reconstruction & analysis: The XTDIC software performs stereo matching (left/right images) and temporal matching (time sequence) to reconstruct 3D coordinates, calculate displacement & strain, and visualize results.

What Can It Measure?

The XTDIC system supports a wide range of measurable physical quantities, including:

• 3D Coordinates & Motion

  • xyz positions, depth (z-on-xy), radial distance, polar angle

  • Displacement, velocity, acceleration

  • Angular displacement, angular velocity, angular acceleration

• Strain & Material Behavior

  • ex, ey, exy, shear angle, principal & secondary strain

  • Mises strain, Tresca strain, gradient tensor

  • Thickness reduction, line strain

  • Elastic modulus, Poisson’s ratio, yield strength

• Advanced Analysis

  • Temperature field coupling

  • Trajectory attitude (6-DOF motion)

  • CAD alignment deviation, FEA comparison

  • Modal & frequency response (FFT, ODS, OMA, UFF)

  • Material forming limit curves (FLC, FLD)

  • Crack opening displacement (COD, CTOD)

  • Thermal expansion & warping (CTE analysis)

Core Technology & Algorithms

• High-precision image recognition & matching

  • Proprietary algorithms for digital speckle & coded markers

  • Accurate feature matching for multi-point tracking

• Flexible high-accuracy camera calibration

  • Photogrammetry-based calibration from mm to tens of meters

  • Supports standard, ultra-wide, ultra-telephoto lenses & microscopes

• Advanced 3D reconstruction

  • Single-camera multi-view photogrammetry for key points

  • Stereo vision for full-field dense 3D data

• Rich data post-processing tools

  • 18 strain/deformation calculation methods

  • Data smoothing, hole-filling, and geometric analysis

  • Integration with CAD & finite element models

Powerful Measurement Performance

• Displacement resolution: nanometer scale

• Strain accuracy: up to 20με

• Strain measurement range: 0.002% to 2000%

• Sample size: from a few mm² to tens of m² (customizable for larger areas)

• Dynamic event capture: up to 1,000,000 fps

• Real-time measurement:

  • Full-field strain: 20 fps

  • Keypoint tracking: 100 fps @ 100 points (up to 1000 fps)

Applications Across Industries

Aerospace

Semiconductor

Aerospace and Ships

Materials Research and Testing

Civil Engineering

Biomedical

Next Steps

Want to learn how XTDIC can optimize your testing and research?
➡ Contact Testech Solutions for a consultation or demonstration.